From October 27 to 29, the 2026 Intel WW LOEM Summit was held in Kuala Lumpur, Malaysia. The annual summit for global OEM partners brought together top computing-industry leaders to discuss the new future of AI PCs and edge computing. Chipsea Technologies (688595), invited as an Intel ecosystem partner, presented multiple generations of EC, SIO, and eBMC products, showcasing a “computing-peripheral chip portfolio” that extends outward from the EC hub into power, connectivity, and out-of-band management.
Looking at the details from the show floor, Chipsea’s highlights come in three parts. First, its EC (embedded controller) has iterated across multiple generations: the company is currently the only EC supplier in the Chinese mainland certified for both the Intel PCL and AMD AVL platforms. Its ECs have entered the global mainstream notebook supply chain with volume shipments; together with Lenovo, it mass-produced the world’s first EC product based on the Zephyr operating system on the Wintel platform, and its level in Lenovo’s ECSL system rose to C1 — Zephyr’s unified architecture cuts development costs, while the PSIRT mechanism enables faster security-vulnerability response. Second, its SIO products are ramping up in DIY motherboards, AI NAS, and AI BOX scenarios, and its dual-port Type-C controller CS32G053H passed both USB PD 3.2 and IEC 62680 international certifications this year. Third, the new-generation eBMC chip CSCB2410 targets edge servers, AI NAS, and industrial PCs, supporting remote power on/off, firmware flashing, and fault diagnosis, adapting to Zephyr while remaining compatible with the standard IPMI protocol and the NC-SI interface; it has already achieved volume sales in edge servers and AI NAS terminals and entered Intel’s reference design platform.
From the perspective of the industry landscape, the accelerating rollout of AI PCs and on-device intelligence is repricing “computing-peripheral chips”: peripheral devices beyond the main SoC — ECs, SIOs, eBMCs, and PD controllers — now determine the experience ceiling of the whole machine in power management, connectivity expansion, and remote maintenance, making them a new battleground for platform vendors’ ecosystem certification. Chipsea’s combinatorial approach — taking the EC as the hub and extending layer by layer into power, connectivity, and out-of-band management — represents a viable path for domestic analog and mixed-signal chips to enter the global supply chain: rather than competing head-on with main processors, they build irreplaceability in ecosystem gaps through platform certification plus production-proven validation. As the number of edge devices grows, out-of-band management (eBMC) is sinking from data centers to the edge, and the market for the computing-peripheral ecosystem will keep expanding.
For Junyi Microelectronics, the maturing ecosystem of computing-peripheral chips directly complements the company’s end-product lines. The power management, connectivity expansion, and remote-maintenance capabilities of Junyi’s K-series edge-intelligent motherboards and edge-computing hosts 5G-EDGE-3399Pro/AI-BOX-3588 are built upon the supply maturity of ECs, SIOs, and eBMCs. The industrial mini PC IPC-i5-1235U, deployed on production lines and in equipment cabinets, has a natural need for out-of-band management capabilities such as remote power control, firmware flashing, and fault diagnosis — the spread of eBMC-class solutions will cut the remote-maintenance cost of Junyi’s industrial machines. The core boards J-3568/J-3576/J-3588 and touch-panel all-in-one machines likewise benefit from the dual stability of domestic computing-peripheral chips in certification and supply. The parallel advance of the domestic peripheral ecosystem and international platform certification gives self-developed end-product makers like Junyi a more complete space of component options.
Source: https://baijiahao.baidu.com/s?id=1880363429536633770 (2026-10-29)