On October 26, Reuters, citing informed sources, reported that Vietnam’s highly anticipated first wafer fab — the project built by military-owned telecom group Viettel — is still advancing, but its target of starting trial production in 2027 now appears difficult to achieve. Chinese media followed up with coverage of the development on October 27.
According to the report, Viettel lacks experience in building semiconductor wafer fabs, and the project has also run into administrative obstacles in securing government funding, delaying construction. Reuters field visits found that the site on the outskirts of Hanoi is still covered with wild vegetation and no plant buildings have risen; satellite imagery comparing January and October this year confirms the point — nine months on, the site has barely moved.
Viewed from the industry landscape, the diversification of global semiconductor capacity is running into a reality check. A wafer fab is a complex systems engineering effort spanning capital, talent, supply chains and utilities — it cannot simply be assembled from land and policy intent. Setbacks in emerging destinations such as Vietnam underscore the scarcity of mature manufacturing ecosystems. For system and board vendors, it is another reminder that supply-chain layout must weigh not only the cost map but also the maturity of the manufacturing ecosystem and delivery certainty.
Junyi Microelectronics has always emphasized “certainty first” in its supply-chain strategy: the Rockchip platform underpinning the J-3568/J-3576/J-3588 core boards offers long-term supply commitments and a mature domestic ecosystem, while key materials for the K-series edge AI boards and edge computing hosts (5G-EDGE-3399Pro/AI-BOX-3588) are evaluated for multi-sourcing and long-horizon availability. Against a backdrop of intensifying volatility in the wafer-manufacturing landscape, a stable platform choice is itself part of product delivery capability.
Source: https://k.sina.com.cn/article_1887344341_707e96d502001x6qk.html (2026-10-27)