On the evening of October 27, STAR Market-listed powder materials company Lianrui New Materials (688300.SH) announced plans to invest RMB 1 billion in a “high-performance powder materials project for semiconductor packaging” at the Shijiaqiao Industrial Park in Jingyan County, Leshan, Sichuan Province, and to establish a new subsidiary — Lianrui New Materials (Sichuan) Co., Ltd. — with registered capital of RMB 150 million as the implementation entity. The RMB 1 billion project will be built in two phases: phase one involves roughly RMB 600 million, while phase two will be dynamically adjusted based on market conditions and phase-one results. Backed by year-on-year growth in both revenue and profit in its Q3 report, the company is moving west into Leshan to formally position itself within the western semiconductor industry chain.
In terms of business details, Lianrui New Materials specializes in advanced inorganic non-metallic powder materials such as silica flour and spherical alumina — key fillers for epoxy molding compounds, copper-clad laminates and thermal interface materials. AI servers and advanced packaging keep raising the bar for thermal conductivity, low thermal expansion and particle-size distribution, and the quality of high-end spherical powders directly determines packaging reliability and thermal performance. Locating this RMB 1 billion expansion in Sichuan creates close-range synergy with the region’s rapidly gathering wafer fabrication and packaging/test capacity — materials and manufacturing closing the loop within the same region, shortening both logistics and response cycles.
From the perspective of industry dynamics, packaging materials are becoming an underrated link in the “computing-power arms race”: as CoWoS advanced packaging capacity tightens and packaging quotes are set to rise 10%-20%, upstream filler supply faces structural tightness as well, and the domestic substitution rate of high-end spherical silica still has substantial headroom. Lianrui’s billion-yuan expansion mirrors the packaging-side price hikes — one end sees foundry capacity shortages forcing prices up, while the other sees materials players laying out capacity ahead of demand. As HBM stack counts climb and chip power dissipation keeps rising, the value share of packaging materials in overall BOMs will steadily increase, and domestic materials makers are shifting their competitive logic from “following substitution” to “positioning to lead.”
For Junyi Microelectronics, the evolution of packaging materials bears directly on board-level reliability and thermal design. Junyi’s core boards J-3568/J-3576/J-3588 and K-series edge AI motherboards must carefully coordinate chip-package thermal characteristics with PCB materials during hardware design; edge computing hosts 5G-EDGE-3399Pro/AI-BOX-3588 and the compact industrial PC IPC-i5-1235U run at sustained high loads on industrial sites, with thermal solutions highly dependent on advances in high-conductivity interface materials. Expanding capacity and upgrading performance of domestic packaging materials will provide more stable upstream support for the high-reliability delivery of Junyi’s machine-level products.
Source: http://k.sina.com.cn/article_5952915720_162d24908067052qw4.html (2026-10-28)