Industry Insights

Industry Insights

2026-10-30

China’s First 8.5th-Generation High-Precision Photomask Substrate Rolls Off the Line in Changsha: Puzhao Materials Grinds Large-Format Glass Flatness to 10 Microns, Breaking a Long-Standing Japanese Monopoly

On October 30, news arrived from Changsha: by virtue of its specialized, ref…

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Industry Insights

2026-10-30

World Computing Power Network Conference and GOSIM Shenzhen 2026 Held Back-to-Back: Cloud-Edge Collaboration Becomes the Shared Agenda as AI Inference Moves from Data Centers to the Factory Floor

In mid-October, the World Computing Power Network Conference and GOSIM Shenz…

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Industry Insights

2026-10-30

Chipsea Takes the Stage at the 2026 Intel LOEM Global Partner Summit: The Chinese Mainland’s Only EC Supplier with Dual Intel PCL and AMD AVL Certification Brings SIO and eBMC to the AI PC and Edge-Computing Peripheral Ecosystem

From October 27 to 29, the 2026 Intel WW LOEM Summit was held in Kuala Lumpu…

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Industry Insights

2026-10-30

Shenzhen Adds Two New National-Level Industrial Clusters: Bao’an Semiconductor Packaging-and-Testing Equipment and Longhua Mini-PC Devices Both Make the List as Niche Hardware Clusters Position Themselves for Edge-Computing Carriers

On October 30, the Ministry of Industry and Information Technology (MIIT) pu…

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Industry Insights

2026-10-29

MIIT Unveils the Report Card of the “AI + Manufacturing” Special Action: AI Application Coverage Above 30% Among Above-Scale Manufacturers, with 1,000+ High-Value Scenarios Across 20 Industries

On October 19, the State Council Information Office held a press conference …

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Industry Insights

2026-10-29

Lianrui New Materials to Invest RMB 1 Billion in a Leshan Semiconductor Packaging Materials Base: Domestic High-End Filler Powders Accelerate Their Positioning Amid the Advanced Packaging Wave

On the evening of October 27, STAR Market-listed powder materials company Li…

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Industry Insights

2026-10-29

Renesas Launches Flagship MCUs RX74M and RX74N: First RX-Family Parts on 22nm with MRAM, Integrating EtherCAT, TSN and Post-Quantum Security at 600MHz

On October 22, Renesas Electronics (TSE: 6723) announced its new flagship 32…

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Industry Insights

2026-10-29

JLC Group Delivers 2026 Q3 Report: First-Three-Quarter Revenue Nears RMB 12 Billion with Net Profit Up 98.71% as the Physical-AI Hardware Innovation Ecosystem Enters Volume Growth

On October 27, Shenzhen JLC Group (the company behind the JLCPCB platform) d…

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Industry Insights

2026-10-29

SK hynix Posts Its First-Ever 100-Trillion-Won Quarter: Operating Profit Soars 632% YoY as the Memory Super Cycle Receives Official Confirmation

On October 28, SK hynix released its fiscal 2026 third-quarter results: quar…

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Industry Insights

2026-10-28

NVIDIA Invests $3 Billion in Meta and Expands the Muse Partnership: AI Giants Deepen Their Bind as the Personal-Agent Ecosystem Takes Shape

On October 27, NVIDIA announced that it will invest $3 billion (about RMB 20…

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Industry Insights

2026-10-28

Vietnam’s First Wafer Fab Slips Behind Schedule: The Viettel Project’s 2027 Trial-Production Target Looks Unlikely as Southeast Asia’s Chip-Making Boom Meets a Reality Check

On October 26, Reuters, citing informed sources, reported that Vietnam&#8217…

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Industry Insights

2026-10-28

Shanghai Issues Its Action Plan for Accelerating New-Generation Intelligent Manufacturing: Full Smart-Factory Coverage by 2028, with 300 High-Level Agents and 8,000 Humanoid Robots Entering Factories

On October 27, the Shanghai Municipal Commission of Economy and Informatizat…

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